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Item specifics
Product Description
The heat dissipation design cools at high speed, and has a large number of heat dissipation holes to ensure the stability of the machine during operation and the life of the hardware. SECC material with 0.7MM thickness, selected materials, hot-dip galvanized steel plate, with high corrosion resistance, toughness and no deformation. Suitable for motherboard: MINI-ITX ultra-thin board (below 17 x 17CM), only supports motherboards with DC IN self-powered. Colour: black Material: SPCC Size: 198 x 45 x 197mm Package Contents: 1 x chis 1 set x mounting screws Only the above package content, |