- 0Carrito
-
Su carrito está vacío.
-
más artículos en el carro...
Carro Total: $0.00
Pasar por caja
Su carrito está vacío.
Carro Total: $0.00
Pasar por caja
|
Item specifics
Product Description
RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone mobile phone BGA Reballing Soldering RELIFE Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique manufacturing of solder past technology, giving a new definition of tin-base technology RELIFE No-clean Soldering Paste RL-402 Sn63/Pb67 183°C Solder Paste 183°C Solder paste with high quality Solder wicking is strong Less residual No clean
![]() ![]() ![]() ![]() ![]()
![]() ![]() ![]()
|